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PILOT TECHNICAL DATASHEET
ELECTRICALLY CONDUCTIVE DIE ATTACH ADHESIVE
DESCRIPTION ABLEBOND(R) 8200C low bleed die attach adhesive is designed for small and medium sized dies across a variety of leadframes including PPF, Cu and Ag. This electrically conductive adhesive offers improved JEDEC performance on QFN type packages. FEATURES * HIgh electrical conductivity * Excellent adhesion to silver and pre-plated leadframe * Oven and snap curable ABLEBOND 8200C adhesive is a new version of the RP-751 series that provides improved MRT on silver and pre-plated leadframe.
ABLEBOND(R) 8200C
Typical Uncured Properties Filler Type Viscosity @ 25C Thixotropic Index Work Life @ 25C Est. Storage Life @ -40C Cure Process Data Weight Loss on Cure Recommended Cure Condition Snap Cure Profile Physiochemical Properties - Post Cure Ionics Chloride Sodium Potassium
8200C Silver 11,500 cP 5.0 24 hours 1 year 8200C 7%
Test Description
Test Method ATM-0018 ATM-0089 ATM-0087 ATM-0068 Test Method ATM-0031
Brookfield CP51 @ 5 rpm Viscosity @ 0.5/Viscosity @ 5 rpm 25% increase in viscosity @ RT
Test Description 10 x 10 mm Si die on glass slide
30 minutes ramp to 175C + 15 minutes @ 175C Zone Number N2 Flow 8200C < 10 ppm < 10 ppm < 10 ppm 1% 1 2 3 4 5 6 7 Time Temp C 140 150 160 200 220 220 220 120 sec 10 liters/minute @ 150C Test Description Teflon flask 5 gm sample / 20-40 mesh 50 gm DI water 100C for 24 hours Thermogravimetric Analysis Test Method ATM-0007 ATM-0073
Weight Loss @ 300C
Typical properties are not intended for use as specification limits. If you need to write a specification, ask for our Standard Release Specification. This is a Pilot product that has been converted to high volume manufacturing and is being monitored for process stability. During this monitoring period, certain properties may be adjusted slightly. 02/06 Page 1 of 3
8200C
Physiochemical Properties - Post Cure Glass Transition Temperature Coefficient of Thermal Expansion 8200C 190C Below Tg Above Tg @ 25C Dynamic Tensile Modulus @ 150C @ 250C Moisture Absorption @ Saturation Thermal/Electrical PropertiesPost Cure Volume Resistivity Thermal Conductivity Mechanical PropertiesPost Cure Die Shear Strength (kgf/die) vs. Temperature Chip Warpage @ 25C vs. Chip Size Test Description Dynamic mechanical thermal analysis 60 ppm/C 130 ppm/C TMA expansion mode Dynamic mechanical thermal analysis using < 0.5mm thick sample Test Method ATM-0112 ATM-0055
4630 MPa (670,000 psi) 1170 MPa (170,000 psi) 780 MPa (110,000 psi)
ATM-0112
0.20% 8200C 0.00017 ohm-cm 1.2 W/mK 8200C @25C 19.1 kg Chip Size 7.6x7.6mm (300 x 300 mil)
Dynamic vapor sorption after 85C/ 85% RH exposure Test Description 4-point probe Laser Flash Test Description 3 x 3 mm (120 x 120 mil) Si die on SPCLF Warpage 16 m 0.38mm (15mil) thick Si die on 0.2mm Ag/Cu LF 6.7 m 10.9 m
ATM-0093 Test Method ATM-0020 ATM-0116 Test Method ATM-0052
ATM-0059
Chip Warpage
Post Dia Attach Cure Post Mold Bake (4 hrs @ 175C)
ATM-0059
APPLICATION GUIDELINES SHIPMENT This Ablestik product is packed and shipped in dry ice at -80C. Inside every dry ice shipment of Ablestik's products is a small packet containing the ABLECUBE. This is a small blue cube which retains its shape at -40C. If the ABLECUBE is exposed to temperatures higher than -40C, the cube will melt. Please check the state of the ABLECUBE to ensure the integrity of the shipment. If the ABLECUBE has melted upon Receiving Inspection, place the entire shipment in a -40C freezer and contact your Ablestik Customer Service or Sales Representative.
UNPACKING Transfer the syringes from the dry ice to a -40C freezer without ANY delays. Freeze-thaw voids will form in the syringes if the syringes are repeatedly thawed and refrozen. STORAGE This Ablestik product must be stored at -40C. The shelf life of the material is only valid when the material has been stored at the specified storage condition. Incorrect storage conditions will degrade the performance of the material in both handling (e.g. dispensing or screen printing) and final cured properties.
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8200C
THAWING Allow the container to reach room temperature before use. After removing from the freezer, set the syringes to stand vertically while thawing. Refer to Syringe Thaw Time chart for the thaw time recommendation. DO NOT open the container before contents reach ambient temperature. Any moisture that collects on the thawed container should be removed prior to opening the container. DO NOT re-freeze. Once thawed to room temperature, the adhesive should not be re-frozen. ADHESIVE APPLICATION Thawed adhesive should be immediately placed on dispense equipment for use. If the adhesive is transferred to a final dispensing reservoir, care must be exercised to avoid entrapment of contaminants and/or air into the adhesive. Adhesive must be completely used within the product's recommended work life of >24 hours. Apply enough adhesive to achieve a 25-50 m (1-2 mil) wet bondline thickness, dispensed with approximately 25% - 50% filleting on all sides of the die. Alternate dispense amounts may be used depending on the application requirements. Star or cross shaped dispense patterns will yield fewer bondline voids than the matrix style of dispense pattern. Contact Ablestik Technical Service Department for detailed recommendation on adhesive application, including dispensing. CURE This adhesive can be cured in box or in-line ovens. The recommended box oven cure temperature for this adhesive is 175C. AVAILABILITY ABLEBOND(R) adhesives are packaged in syringes or jars per customer specification. Available package sizes range from 1cc to 30cc and 1 ounce to 1 pound. For details, refer to the Ablestik Standard Package Data Set or contact your Customer Service Representative.
CAUTION: This product may cause skin irritation in sensitive persons. Avoid skin contact. If contact does occur, wash area immediately with soap and water. Please refer to the Material Safety Data Sheet for more details.
20021 Susana Road, Rancho Dominguez, CA 90221 (310) 764-4600 Fax (310) 764-2545 Customer Service Fax (310) 764-1783
For a technical contact nearest you, visit www.ablestik.com
The information given and the recommendations made herein are believed to be accurate but no guarantee of their accuracy is made. In every case we recommend that purchasers before using any product conduct their own tests to determine whether the product is suitable for their particular purposes under their own operating conditions. No representative of ours has any authority to waive or change the foregoing provisions but, subject to such provisions, our engineers are available to assist purchasers in adapting our products to their needs. Nothing contained herein shall be construed to imply the nonexistence of any relevant patents or to constitute a permission, inducement or recommendation to practice any invention covered by any patent, without the authority from the owner of this patent. These materials are not designed or manufactured for implantation in the human body. Approval from FDA for such use as part of any product to be implanted in the human body has NOT been sought nor received. We also expect purchasers to use our products in accordance with the guiding principles of the American Chemistry Council's Responsible Care(R) program.
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